The official Xiaomi Mi 9 news continues as we receive more details from Xiaomi ahead of the phone’s China launch on February 20.
Xiaomi announced via its MIUI forum that the Mi 9’s main rear camera sensor would come in at 48 megapixels, while the company’s global spokesperson Donovan Sung revealed on Twitter it would house a Snapdragon 855 chipset.
The MIUI forum post also touted the device’s “holographic technology,” but this simply refers to the unique colors on the device’s rear, rather than anything Star Wars chess-like.
None of these revelations were particularly unexpected, however. The Snapdragon 855 is the latest and greatest Qualcomm chipset (Xiaomi’s flagships tend to employ flagship Qualcomm chips), while the 48MP camera has long-since been expected to trend on the top-tier 2019 Android devices.
Still, we’re steadily filling in gaps in our Mi 9 knowledge as we approach launch day. Just yesterday, Xiaomi’s senior vice president Wang Xiang published some images of the phone, showing off its triple rear camera and a full view of its back. Check that out at the link.
We’ll be at MWC 2019 in Barcelona next week where we should be able to hands-on with the device. Expect coverage on that coming around February 24.
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